G06 - Plating Additives

Wednesday, 16 October 2019: 08:20-09:40
Room 210 (The Hilton Atlanta)
Chairs:
Lingyun Wei and Wei-Ping Dow
08:20
Novel Inverse Analysis Method to Identify Current Density Distribution Under Suppression Effect By Polyethylene Glycol
T. Ishii, K. Amaya, and Y. Onishi (Tokyo Institute of Technology)
08:40
Additive Transport, Adsorption, and Inclusion in Electroless Deposition of Copper
R. A. Zeszut Jr. (University of Dayton Research Institute, Case Western Reserve University) and U. Landau (Case Western Reserve University)
09:00
Computational Modeling of Copper Deposition in through Silicon Via Structures
T. M. Braun, D. Josell, and T. P. Moffat (NIST)
09:20
Superconformal and Bottom-up Filling of High Aspect Ratio Features
D. Josell (National Institute of Standards and Technology), T. M. Braun (NIST), S. Ambrozik (National Institute of Standards and Technology, NIST), and T. P. Moffat (NIST)
See more of: G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
See more of: Electronic Materials and Processing
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