G06 - PCB Processes

Tuesday, 15 October 2019: 14:00-15:40
Room 210 (The Hilton Atlanta)
Chairs:
Muneharu Kondo and Rohan Akolkar
14:00
(Invited) Innovative Advances in Copper Electroplating for IC Substrate Manufacturing
K. Ganesan (Intel Corpororation), R. Manepalli, M. Wall, A. Wentzel, H. Castro, W. Li, and T. Heaton (Intel Corporation)
14:40
Selective Cu Electrodeposition for Sub-Micrometer Redistribution Layers
J. Lee, K. Park, and B. Yoo (Hanyang University)
15:00
Electroless Copper Deposition Using Complexed Copper(II) Ion As Catalyst for Printed Circuit Board Fabrication
W. P. Dow (National Chung Hsing University)
15:20
Using Reduce Graphene Oxide (rGO) As a Conducting Layer for a PCB Metallization
W. P. Dow (National Chung Hsing University)
See more of: G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
See more of: Electronic Materials and Processing
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