The initial bulk MoS2 was in crystal form, which was used to prepare the MoS2 nanoflakes. The preparation procedure for the MoS2 flakes was by using mechanical exfoliation technique. Nitto SPV224 PVC tape had been used to exfoliate bulk MoS2, where part of the bulk MoS2 crystal is placed on the sticky part of the tape. The tape is then folded on the MoS2 piece with the tape surrounding the crystal on the top and bottom. The tape is then separated from each other, which results in exfoliation of the MoS2 into flakes. The more the steps are repeated of this process, the thinner the flakes are. The flakes on the tape were transferred to a p-Si wafer on a hot plate at 50C and bonded to create the MoS2/Si interface.
The achieved MoS2 nanoflakes on p-Si wafer sample had been imaged using AFM topography and conductivity measurements. The AFM images were collected to identify the distribution of the flakes. AFM images showed clear flakes on the p-Si wafer at which they were distributed randomly over the surface. The thickness of single monolayer flakes measured was 0.65nm and two monolayer flakes were 1.3 nm. Furthermore, conductive AFM was employed to obtain the IV curve over the flake and obtain their electrical properties, where forward and reverses scanning was done showing a hysteresis loop. The hysteresis observed showed a voltage window gap of around ∆Vth=0.5 V. This indicates electron tunneling and charge storage at the MoS2/Si interface or in the MoS2. Finally, the results, highlight the potential use of 2D MoS2 flakes in future no power memory devices.
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