Tuesday, 11 October 2022: 11:00
Room 311 (The Hilton Atlanta)
The dry process is progressing in the manufacturing process of semiconductor packages. The semi-additive process for forming the rewiring layer is required to be finer and more reliable than ever. The interface between the insulating resin and the copper wiring is being smoothed in order to reduce transmission loss during high-frequency communication. The conventional electroless plating method using the anchor effect is disadvantageous for smoothing. Therefore, a sputtering method is used to form the seed layer. In general, copper spatter has weak adhesion to resin, so titanium spatter is combined to increase the adhesion strength. However, etching in the lithography process requires two types of processes, titanium and copper.
We investigated the improvement of copper sputtering adhesion to glass epoxy resin by a high-speed sputtering device. Adhesion strength was improved by performing plasma treatment and vacuum ultraviolet treatment as pretreatment for high-speed sputtering. Surface modification was analyzed and evaluated by XPS. We report on the process and evaluation method that contribute to the dryness of the packaging process.