D03 - Processing and Metrology

Wednesday, 12 October 2022: 09:00-12:30
Room 309 (The Hilton Atlanta)
Chairs:
Yue Kuo and Cheryl Hartfield
09:00
Introductory Remarks
09:05
(Invited) Emerging Technologies for Advanced 3D Package Characterization to Enable the More-Than-Moore Era
C. Hartfield, W. Harris, A. Gu, M. Terada (Carl Zeiss Microscopy LLC), V. Viswanathan, L. Jiao (Research Microscopy Solutions, Carl Zeiss Pte Ltd), and T. Rodgers (Carl Zeiss Microscopy GmbH)
09:45
Fabrication and Characterization of Conductive FeCo@Au Nanowire Alloys for Semiconductor Connector
I. Y. Kim, G. H. Lim, C. Y. Kim, M. J. Lee, J. Kim, D. H. Kim, and J. H. Lim (Gachon University)
10:05
Break
10:35
Cu Deposition on AAO Substrate for Interposer Applications
C. Y. Kim, I. Y. Kim, D. H. Kim, G. H. Lim, M. J. Lee, J. Kim, and J. H. Lim (Gachon University)
11:15
Reliability of Complete Plasma Etched Ru/Cu Lines
J. Q. Su and Y. Kuo (Texas A&M University)
11:35
Discussion
11:55
Concluding Remarks
See more of: D03: Advanced 3D Interconnect Technologies and Packaging
See more of: Dielectric Science and Materials
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