D03 Advanced 3D Interconnect Technologies and Packaging

Lead Organizer: Yaw Obeng (NIST)

Co-organizers: Mitsumasa Koyanagi (Tohoku University) , Oana Leonte (Berkeley Polymer Technologies, Inc.) , Fred Roozeboom (TNO-Holst Centre, Eindhoven) , Z. Karim (Aixtron, Inc.) , Peter Ramm (Fraunhofer EMFT) and Stephane Moreau ()

Monday, 10 October 2022

09:00-12:00


D03 - Advanced 3D Interconnect and Packaging-CAD
Room 309
Chair(s): Yaw Obeng and Stephane Moreau

14:00-15:50


D03 - Integration
Room 309
Chair(s): Oana Leonte and Zia Karim

Tuesday, 11 October 2022

08:40-12:10


D03 - Tutorial on Semiconductor Advanced Packaging
Room 309
Chair(s): Yaw Obeng, Fred Roozeboom and Peter Ramm

13:30-16:05


D03 - Heterogeneous Integration / Packaging
Room 309
Chair(s): Peter Ramm, Yaw Obeng and Zia Karim

Wednesday, 12 October 2022

09:00-12:30


D03 - Processing and Metrology
Room 309
Chair(s): Yue Kuo and Cheryl Hartfield

13:30-17:05


D03 - Reliability / NIST
Room 309
Chair(s): Stephane Moreau and Yaw Obeng

18:00-20:00