D03 - Heterogeneous Integration / Packaging

Tuesday, 11 October 2022: 13:30-16:05
Room 309 (The Hilton Atlanta)
Chairs:
Peter Ramm , Yaw Obeng and Zia Karim
13:30
Introductory Remarks
13:40
(Invited) Reaction-Diffusion Modeling for Reliability Assessment of Heterogeneously Integrated Packages
S. Prasad, H. Liao, C. Jois, and G. Subbarayan (Purdue University)
14:20
(Invited) Optoelectronic and 3D Applications with Die to Wafer Direct Bonding: From Mechanisms to Applications
F. Fournel, L. Sanchez, B. Montmayeul, G. Mauguen, L. Bally, V. Larrey, C. Morales, E. Bourjot, C. Ladner, A. Bond, S. Moreau, and B. Szelag (Univ. Grenoble Alpes, CEA, LETI)
15:00
(Invited) How the Semiconductor Research Corporation (SRC) Is Expanding Robust Advanced Packaging with the US and like-Minded Allies
J. R. Oakley (Semiconductor Research Corporation)
15:40
Discussion
16:00
Concluding Remarks
See more of: D03: Advanced 3D Interconnect Technologies and Packaging
See more of: Dielectric Science and Materials
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