Tuesday, 11 October 2022: 15:00
Room 309 (The Hilton Atlanta)
As investments in technology are made it will be important to consider what technologies are invested in. Advanced Packaging will be the key enabler of the next microelectronic revolution, as it allows increasing device density and functionality per footprint while realizing a broad spectrum of new products through heterogeneous integration. In fact, advanced packaging is becoming equivalent of the transistor of the Moore’s Law and ITRS era. However, the US lacks the necessary advanced packaging ecosystem: the US has not been a cost-effective location to develop a robust advanced packaging sector. The Semiconductor Research Corporation (SRC) is leading efforts in expanding robust advanced packaging with the US and like-minded allies.
SRC has also served as a beacon for the community and has been relied on to bring similar but different interests together to achieve consensus on direction setting for the industry. Through a series of five workshops, 50+ presentations, and hundreds of international experts from industry, government, and academia SRC published the 2030 Decadal Plan For Semiconductors in January 2021. By soliciting participation from experts in all parts of the semiconductor ecosystem, the Decadal Plan serves to define the technical needs to achieve strategic goals by 2030, informing the community of ‘what’ needs to be done and not the ‘how’. 