D03 - Integration

Monday, 10 October 2022: 14:00-15:50
Room 309 (The Hilton Atlanta)
Chairs:
Oana Leonte and Zia Karim
14:00
Introductory Remarks
14:05
(Invited) Advancing 3D Packaging for Heterogenous Systems Integration
A. Elsherbini (Intel coporation)
14:45
(Invited) Fan-out Wafer Level Packaging: Opportunities and Challenges Towards Heterogeneous Systems
P. Coudrain, A. Garnier, L. Castagné (CEA-Leti, Université Grenoble Alpes, F-38000 Grenoble, France), A. Plihon (Aurélia Plihon), R. Vélard, R. Franiatte, J. C. Souriau, J. Pignol, and E. Ollier (CEA-Leti, Université Grenoble Alpes, F-38000 Grenoble, France)
15:25
(Invited) Probing Triaxial Stress States Using Curvature-Based Methodology for Enabling Highly Robust and Reliable Integrated 3D Systems-on-Package in Advanced Microelectronics Industries
A. Budiman (OIT) and S. TIppabhotla (Institute of Microelectronics (IME), SINGAPORE)
15:45
Concluding Remarks
See more of: D03: Advanced 3D Interconnect Technologies and Packaging
See more of: Dielectric Science and Materials
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