D03 - Tutorial on Semiconductor Advanced Packaging

Tuesday, 11 October 2022: 08:40-12:10
Room 309 (The Hilton Atlanta)
Chairs:
Yaw Obeng , Fred Roozeboom and Peter Ramm
08:40
Introductory Remarks
08:45
(Invited) Tutorial on Semiconductor Advanced Packaging
J. H. Lau (Unimicron Technology Corporation)
10:00
Break
10:20
Tutorial on Semiconductor Advanced Packaging Pt2
11:35
Discussion
12:05
Concluding Remarks
See more of: D03: Advanced 3D Interconnect Technologies and Packaging
See more of: Dielectric Science and Materials
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