D03 - Advanced 3D Interconnect and Packaging-CAD

Monday, 10 October 2022: 09:00-12:00
Room 309 (The Hilton Atlanta)
In this session we discuss the applications of CAD in Advanced 3D Interconnect Technologies and Packaging
Chairs:
Yaw Obeng and Stephane Moreau
09:00
Introductory Remarks
09:05
(Invited) 3DIC Hierarchical Thermal and Mechanical Analysis with Continuum and Atomistic Modeling
X. Xu, X. W. Lin, Y. Gao (Synopsys, Inc.), and S. Smidstrup (Synopsys Denmark ApS)
09:45
Break
10:15
(Invited) Advanced Methodology for Assessing Chip Package Interaction Induced Stress Effects on Chip Performance and Reliability
J. H. Choy, V. Sukharev, and A. Kteyan (Siemens EDA)
10:55
(Invited) ML-Based Fast on-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs
N. Chang (Ansys)
11:35
Discussion
11:55
Closing Remarks
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