D03 - Reliability / NIST

Wednesday, 12 October 2022: 13:30-17:05
Room 309 (The Hilton Atlanta)
Chairs:
Stephane Moreau and Yaw Obeng
13:30
Introductory Remarks
13:35
(Invited) Towards the Physical Reliability of 3D-Integrated Systems
Y. Obeng (National Institute of Standards and Technology), P. K. Amoah (Electrical Eng. Dept., Old Dominion University, Norfolk, VA 23529), C. E. Sunday (National Institute of Standards and Technology), C. Okoro (NIST), J. Ahn, L. You, D. Veksler, and J. Kopanski (National Institute of Standards and Technology)
14:15
(Invited) Empirical Modeling of Broadband Insertion Losses in TSV-Interconnects
K. J. Coakley, P. Kabos (NIST), S. Moreau (Univ. Grenoble Alpes, CEA, LETI, 38000 Grenoble, France.), and Y. Obeng (National Institute of Standards and Technology)
14:55
(Invited) Assessing Reliability of Materials for Electronic Interconnects
R. Keller (National Institute of Standards and Technology)
15:35
Break
16:05
(Invited) Nonlinear and Electro-Thermo-Mechanical Effects in Heterogeneous Electronics at Microwave Frequencies
J. C. Booth, N. Orloff, C. Long, A. Hagerstrom, A. Stelson, N. Jungwirth, and L. Suriyasena Liyanage (NIST)
16:45
Discussion
16:55
Concluding Remarks
See more of: D03: Advanced 3D Interconnect Technologies and Packaging
See more of: Dielectric Science and Materials
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