G01 - Electrochemical Film Growth and Surface Modification

Tuesday, 11 October 2022: 08:00-12:30
Room 210 (The Hilton Atlanta)
08:00
Welcoming Remarks
08:10
(Invited) Electrochemistry: Adventures in Metallization
E. J. O'Sullivan (IBM Research Division, Thomas J. Watson Research Center)
08:40
(Invited) Surface Modification to Control Wetting and Adhesion of Aqueous Solutions
D. W. Hess (The Electrochemical Society)
09:10
(Invited) Chemistry Effects on the Electrodeposition of Re, Co, and Alloys
Q. Huang (University of Alabama)
09:40
(Invited) Understanding Residual Stress in Thin Films through a Kinetic Model
E. Chason (Brown University)
10:10
Break
10:30
(Invited) In-Situ Observation of Copper Electroplating with Additives Using Micofluidic Devices
M. Hayase and T. Akita (Tokyo University of Science)
11:00
(Invited) In-Situ Stress Measurement during Electrochemical Processing
G. Stafford (NIST)
11:30
(Invited) Superconformal Cu Electrodeposition
T. P. Moffat, T. M. Braun, D. Raciti, and D. Josell (National Institute of Standards and Technology)
12:00
(Invited) Investigation of Pt-Alloy and Strained Pt As Electrocatalysts
C. McKeown (Physics Department, Universiy of Limerick, Bernal Institute, Universiy of Limerick) and F. M. F. Rhen (Physics Department, University of Limerick, Bernal Institute, Universiy of Limerick)
See more of: G01: The Long Reach of Electrochemistry – Semiconductors, Metallization, and Energy Storage: In Honor of D. Noel Buckley
See more of: Electronic Materials and Processing
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