0.20 M (M: mol dm-3) Si powder (Kojundo Chemical Laboratory, 99.99%) with a particle diameter of 45 μm or less was added to a simple basic solution of 1 mM hydrogen tetrachloroaurate (III) solution pH-adjusted with sodium hydroxide, or a simulated leaching solution containing 1 mM sodium gold (I) sulfite, 1 M ammonium thiosulfate, 1 M ammonium hydroxide, and 0.5 mM copper (II) sulfate, which solution pH was at 9.3. The solution was stirred at 200 rpm using a magnetic stirrer and kept at 298 K of temperature. After filtering the solution, the concentrations of the metal in the filtrate were measured by an ICP-AES (Hitachi, SPS7800) and the recovery was determined from the change in concentration before and after the recovery process.
Figure 1 shows the recovery of gold from the simple basic solution (Fig. 1a) and the simulated leaching solution (Fig. 1b). The recovering rate form the simple basic solution was increased with solution pH. The long time treatment at the solution pH of 8 for 24h increased the recovery to 100%. Using bare Si powder, which was pretreated with a HF solution for dissolving an oxide layer on Si surface, shortened the treatment time to 45 min for getting 100% of recovery from the solution at the pH of 8. These results indicate that Si oxide layer inhibits gold recovery from the basic solution without fluoride species. The recovery of gold from the simulated leaching solution increased with treatment time and reached 98% or more at the treatment time of 120 min (Fig. 1b). The recovery of copper, which was added as the oxidation aid, was less than 10%. This suggests the possibility that gold is selectively recovered from the leaching solution including less noble metal than gold.
ACKNOWLEDGEMENT
The present work was partly supported by JSPS KAKENHI (JP26289276).
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