Recent advances in the synthesis of 2-dimensional (2D) materials-based inks has increased the design space for additive manufacturing of flexible hybrid electronics (FHE) and sensors. Such systems stand to benefit from high performance flexible silicon IC’s for signal processing and amplification, while also leveraging the high surface area and unique physical properties of 2D materials as sensor electrodes. For example, previous work has elucidated the fundamental role of crystal defects in the sensing mechanisms of graphene chemiresistors, however, such sensors are yet to find widespread commercial application. Integration of graphene with flexible silicon ICs could help expedite the adoption of such sensors in industry, as sensor response to target analytes could be isolated from other environmental factors through rapid signal processing techniques. Furthermore, advances in additive manufacturing of such systems could further enable widespread adoption of FHE’s for applications requiring on-demand manufacturing and repair of sensors and systems. Towards this end, the Advanced Nanomaterials and Manufacturing Laboratory at Boise State University has undertaken several projects to help overcome obstacles facing the integration of 2D materials with FHE systems and sensors. This talk will highlight results of several ongoing studies on the integration of 2D materials with flexible silicon ICs including limiting factors of power dissipation in printed graphene electrodes, the electrochemical response of fully printed graphene electrochemical sensors, and the reliability of flexible silicon die attach strategies for FHE system integration.