Electrochemistry 1

Sunday, 30 September 2018: 14:00-16:20
Universal 9 (Expo Center)
Chair:
William Matthew Reichert
14:00
(Invited) Ultrasound Application and Multi-Step Reactions in Electrodeposition of Refractory Metals
L. Seidl (Technische Universität München), L. Asen (Technical University of Munich, Inst. of Informatics VI), G. Yesilbas, P. Fischer, F. Kühn (Technische Universität München), and O. Schneider (Technical University of Munich, Inst. of Informatics VI)
15:00
Electrodeposition of Si in Molten CaCl2 Above 1300K
T. Takenaka (Kansai University), R. Shimokawa, H. Okada (Graduate School of Kansai University), and T. Morishige (Kansai University)
15:20
Break
15:40
Sn-Cu Codeposition from Non-Aqueous Solvents for Wafer Bonding Applications: A Pulse Plating Study
M. Pallaro, G. Panzeri, and L. Magagnin (Politecnico di Milano)
16:00
Vanadium Electrorefining in NaCl–KCl–VCl2 Melts
I. B. Polovov, M. V. Chernyshov, V. A. Volkovich, O. I. Rebrin (Ural Federal University), and A. N. Rylov (JSC Uralredmet)