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High Rate, Stable Porous Silicon Deposition By Thermal Plasma Technology

Thursday, 23 June 2016
Riverside Center (Hyatt Regency)
R. C. M. Bosch, D. M. Borsa (Meyer Burger (Netherlands) B.V.), and F. M. Mulder (Delft University of Technology)
Meyer Burger (Netherlands) B.V. is a manufacturer of industrial high speed deposition equipment. Our thermal plasma deposition technology has been used since two years to produce thick silicon coatings on metal foils for battery applications. In several collaborations we have demonstrated high quality coatings at high deposition speed (>10 micron / min) on 3D structured current collectors, where coating stability (cycle life) is obtained by growth parameters and porosity of the amorphous coatings. In one example we have used this growth process to deposit 2.1 mg/cm2 silicon on a thin conductive foil which resulted in a stable capacity level of around 1000mAh/g after 100 cycles (testing ongoing at Delft University of Technology).

The presentation will show more details on the deposition technology, growth mechanism and the properties of the thick stable silicon coatings. The economics of volume production (€ / kWh) with our 2-side R2R coating equipment for 100% silicon based anodes will also be highlighted and compared to nowadays slurry-based coating technologies.