994
Tailoring Gold Plating for Thermal-Compression Bonding

Wednesday, May 15, 2013: 14:40
Windsor West, Mezzanine Level (Sheraton)
Luca Magagnin , Politecnico di Milano, Milan, Italy
Pietro Luigi Cavallotti , Politecnico di Milano
Simona Ieffa , Politecnico di Milano

Abstract:

See more of: Afternoon Session
See more of: F2: Novel Design and Electrodeposition Modalities
See more of: Electrochemical/Chemical Deposition and Etching
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