2387
Extreme Bottom-Up Filling of Through Silicon Vias: Cu and Au

Tuesday, October 29, 2013: 11:30
Union Square 23/24, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Daniel Josell , NIST, Gaithersburg, MD
Thomas P. Moffat , NIST, Gaithersburg, MD

Abstract:

  • F5-2387 (592.4KB) - Abstract Text
See more of: Electrochemical Nanofabrication in Emerging Applications
See more of: F5: Emerging Opportunities in Electrochemical Deposition for Nanofabrication
See more of: Electrochemical/Chemical Deposition and Etching
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