2386
Influence of Polyalkyl Glycol Polymers On Copper Filling of Damascene Interconnects

Tuesday, October 29, 2013: 11:10
Union Square 23/24, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Kevin Ryan , College of Nanoscale Science and Engineering
Kathleen A Dunn , College of Nanoscale Science and Engineering
Jobert van Eisden , Atotech USA
James D Adolf , Atotech USA, Atotech USA, Albany, NY

Abstract:

  • F5-2386 (171.6KB) - Abstract Text
See more of: Electrochemical Nanofabrication in Emerging Applications
See more of: F5: Emerging Opportunities in Electrochemical Deposition for Nanofabrication
See more of: Electrochemical/Chemical Deposition and Etching
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