2385
Numerical Simulation of the Effect of Additives On Copper Electro-Deposition

Tuesday, October 29, 2013: 10:50
Union Square 23/24, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Litao Yin, Ph.D. student , National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing, China
Ying Jin, Doctor , National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing, China
Lei Wen, Doctor , National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing, China
Xiuli Zhang , North China Electric Power Research Institute Co. Ltd

Abstract:

See more of: Electrochemical Nanofabrication in Emerging Applications
See more of: F5: Emerging Opportunities in Electrochemical Deposition for Nanofabrication
See more of: Electrochemical/Chemical Deposition and Etching
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