Electrochemical Nanofabrication in Emerging Applications

Tuesday, October 29, 2013: 08:00-11:50
Union Square 23/24, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Chairs:
M. Buck and Mark Anderson
08:00
Self-Healing Electrostatic Shield Mechanism for Dendrite Control During Electrodeposition
Ji-Guang Zhang, Pacific Northwest National Laboratory; Fei Ding, Pacific Northwest National Laboratory; Wu Xu, Ph.D, Pacific Northwest National Laboratory; Xilin Chen, Ph.D., Pacific Northwest National Laboratory; Yaohui Zhang, Pacific Northwest National Laboratory; Eduard N Nasybulin, Ph.D, Pacific Northwest National Laboratory; Gordon L Graff, Pacific Northwest National Laboratory, Richland, WA; Maria Sushko, Pacific Northwest National Laboratory, Richland, WA
08:30
Nonvolatile Resistance Switching in Electrodeposited Metal Oxide Thin Films
Jay A. Switzer, Ph.D., Missouri University of Science and Technology; Jakub A. Koza, Ph.D., Missouri University of Science and Technology; Ian Schroen, Missouri University of Science and Technology
09:00
Superconformal Film Growth: Challenges and Opportunities
Thomas P. Moffat, NIST; Guokun Liu, NIST; Shouzhong Zou, Miami University; Lee Richter, NIST; Liang-Yueh Ou Yang, NIST; Daniel Wheeler, NIST; Daniel Josell, NIST
09:20
The Advanced Monitoring of Organic Additives in Copper Electroplating Baths
Michael Pavlov, Ph.D., ECI Technology; Eugene Shalyt, Ph.D., ECI Technology; Peter Bratin, Ph.D., ECI Technology; Xiaoxuan Sun, M.Sc., Columbia University
09:40
Break
10:30
Palladium-Free Surface Metallization of Polycarbonate Substrate By Inkjet-Printing Technology
Huei-Fang Huang, Master, Department of Chemical Engineering National Chung Hsing University; Wei-Ping Dow, National Chung Hsing University
10:50
Numerical Simulation of the Effect of Additives On Copper Electro-Deposition
Litao Yin, Ph.D. student, National Center for Materials Service Safety, University of Science and Technology Beijing; Ying Jin, Doctor, National Center for Materials Service Safety, University of Science and Technology Beijing; Lei Wen, Doctor, National Center for Materials Service Safety, University of Science and Technology Beijing; Xiuli Zhang, North China Electric Power Research Institute Co. Ltd
11:10
Influence of Polyalkyl Glycol Polymers On Copper Filling of Damascene Interconnects
Kevin Ryan, College of Nanoscale Science and Engineering; Kathleen A Dunn, College of Nanoscale Science and Engineering; Jobert van Eisden, Atotech USA; James D Adolf, Atotech USA
11:30
Extreme Bottom-Up Filling of Through Silicon Vias: Cu and Au
Daniel Josell, NIST; Thomas P. Moffat, NIST