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Reflectance Studies in Silicon Nanowires Grown By Electroless Etching
The electroless process begins with the cleaning of silicon substrates. They were cleaned in acetone, methanol and deionized water, then blow-dried with N2. They are dipped in hydrofluoric acid (HF) 49% solution for 1 min to remove any remaining oxide.
The silicon (Si) wafers are dipped for 45 minutes at room temperature in an electroless solution prepared in a petri dish containing silver nitrate (AgNO3) and hydrofluoric acid (HF) [4].
The substrates are dipped and galvanic reactions disperse silver ions on their surface, losing silicon as SiF6. As a consequence of this etching process, the removal of Si via Ag ions results in vertically aligned arrays of SiNWs covered with silver dendrites. Varying the heights of the SiNWs(fig. 1). changes their optical reflectance. A target optical reflection would be 0.8.
Fig 1. Cross sectional SEM images of the vertically standing Si NW arrays obtained by electroless etching.
REFERENCES
[1] Jin-Young Jung, Han-DonUm, Sang-WonJee, Kwang-TaePark, JinHoBang, Jung-HoLee, “Optimal design for antireflective Si nanowire solar cells,” Solar Energy Materials & Solar Cells, 2013.
[2] Baris Ozdemir, Mustafa Kulakci, Rasit Turan and Husnu Emrah Unalan, “Effect of electroless etching parameters on
the growth and reflection properties of
silicon nanowires,” IOP Science, 2011.
[3] Hua Bao and Xiulin Ruan, "Optical absorption enhancement in disordered
vertical silicon nanowire
arrays for photovoltaic applications," OPTICS LETTERS, 2010.
[4] R. G. Mertens and K. B. Sundaram, “Recession and Characterization of Patterned Nanowires Grown by Electroless Etching of Silicon”. ECS Journal of Solid state Science and Technology, 2012.