225th ECS Meeting (May 11-15, 2014)

May 11 - 15, 2014

C. Martin and C. Grgicak (Department of Biomedical Forensic Sciences, Boston University School of Medicine)

D. Wang (University of Connecticut)

N. Hanna, A. Reilly, A. Crawford, and C. F. Windisch Jr. (University of Central Missouri)

M. M. P. Machado, F. W. D. S. Lucas, E. C. Pereira (Universidade Federal de São Carlos, São Carlos-SP), and M. C. Lopes (Universidade Estadual do Centro Oeste, Guarapuava, PR)

S. Park (Sungkyunkwan University, Samsung Electronics Co.ltd), I. Kim, Y. Son, Y. Park, J. Choi (Samsung Electronics Co.ltd), and Y. Roh (Sungkyunkwan University)

M. May (Techmetals Incorporated), E. Paul (Urbana University), and V. Katovic (Wright State University)

J. Benson, S. Boukhalfa, I. Kovalenko (School of Materials Science and Engineering, Georgia Institute of Technology), M. Schauer (Nanocomp Technologies, Inc.), and G. Yushin (School of Materials Science and Engineering, Georgia Institute of Technology)

R. Jain, D. Kumar, and V. LAL (Jiwaji University, Gwalior (M.P.) India)

S. Lee (Samsung Electronics Co., Sungkyunkwan University), C. W. Yang (Sungkyunkwan University), T. J. Park (Samsung Electronics Co.), J. K. Kim (Samsung Electronics Co., Sungkyunkwan University), J. H. Ahn, J. Choi, and G. Y. Song (Samsung Electronics Co.)

K. Sano, N. Tasugi, N. Watanabe, and I. Koiwa (Kanto Gakuin University)

N. Tasugi, K. Sano, N. Watanabe, and I. Koiwa (Kanto Gakuin University)

M. Islam (Nano-Bio Lab, University of Texas at Arlington, Arlington, TX 76019, USA, Department of Electrical Engineering, University of Texas at Arlington, Arlington, TX 76011, USA), A. I. Mahmood (Department of Electrical Engineering, University of Texas at Arlington, Arlington, TX 76011, USA, Nano-Bio Lab, University of Texas at Arlington, Arlington, TX 76019, USA), Y. T. Kim (Department of Bioengineering, University of Texas at Arlington, Arlington, TX 76010, USA), and S. M. Iqbal (Department of Electrical Engineering, University of Texas at Arlington, Arlington, TX 76011, USA, Nano-Bio Lab, University of Texas at Arlington, Arlington, TX 76019, USA)

D. Damien (Indian Institute of Science Education and Research Thiruvanathapuram, India), P. M. Sudeep (Cochin University of Science and Technology, Cochin, India), T. Narayanan (CSIR-Central ElectroChemical Research Institute, Karaikudi, India), M. R. Anantharaman (Cochin University of Science and Technology, Cochin, India), P. M. Ajayan (MEMS Department, Rice University, Houston, Texas 77005, United States), and M. M. Shaijumon (Indian Institute of Science Education and Research Thiruvanathapuram)

A. Seki, Y. Shimoyama, M. Ogawa, S. Umezu, and Y. Kunugi (Tokai University)

T. Zhang, M. Ueda, Y. Yamada, and M. Morimitsu (Doshisha University)

B. Xu, M. Zhang, D. Xue, R. Qu, and G. Ling (Department of Materials Science and Engineering, Zhejiang University)

H. Yu (Process Development / TD, System LSI Division, Samsung Electronics Co., Ltd., School of Information and Communication Engineering, Sungkyunkwan University), D. S. Shin, S. Kang, M. Park, N. I. Lee, J. H. Ku (Process Development / TD, System LSI Division, Samsung Electronics Co., Ltd.), and Y. Roh (School of Information and Communication Engineering, Sungkyunkwan University)

Y. Cao (School of Materials Science and Engineering, Lab for Advanced Materials Processing Technology, Tsinghua University)

C. H. Chiu, W. I. Liang, C. W. Huang, Y. H. Chu, and W. W. Wu (Department of Materials Science and Engineering, National Chiao Tung University)

E. Karthik and K. L. Phani Sr. (Central Electrochemical Research Institute)

Z. HU (UNIVERSITY OF UTAH), J. Vatamanu (University of Utah), and D. Bedrov (The University of Utah)

F. Wu (School of Materials Science and Engineering, Georgia Institute of Technology, School of Metallurgy and Environment, Central South University), A. Magasinski, and G. Yushin (School of Materials Science and Engineering, Georgia Institute of Technology)

J. Y. Koh, E. H. Kim, S. S. Park, and Y. Jung (KOREATECH)

Y. Shimoyama, M. Furue, T. Kikuchi, K. Tomita, and Y. Kunugi (Tokai University)

D. B. Nguyen and W. G. Lee (Department of Chemical Engineering, Kangwon National University)

N. Aoki, T. Arisaka, B. Zhang, and T. Kondo (Ochanomizu University)

M. Handayani, S. Gohda, H. Tanaka, D. Tanaka, and T. Ogawa (Osaka University)

L. Cirrincione (Hunter College, Department of Physics and Astronomy), T. Nosach, P. Stallworth, S. Greenbaum (Department of Physics and Astronomy, Hunter College of City University of New York), Y. Janssen (Chemistry Department at Stony Brook University), and P. Khalifah (Chemistry Department at Brookhaven National Laboratory, Chemistry Department at Stony Brook University)

K. Ahlbrecht, C. Hupbauer (Fraunhofer Institute for Chemical Technology ICT), J. Tübke (Fraunhofer ICT), and M. J. Hoffmann (Karlsruhe Institute of Technology (KIT))

C. Hu (Key Laboratory for Soft Chemistry and Functional Materials of Ministry Education, Nanjing University of Science and Technology, Nanjing, China.)

F. Huang (University of Connecticut) and C. J. Cornelius (University of Nebraska)

M. Hashimoto, T. Gunji, A. J. Jeevagan, T. Tanabe, T. Tsuda, S. Kaneko (Kanagawa University), M. Miyauchi (Tokyo Institute of Technology), and F. Matsumoto (Kanagawa University)

A. S. Gomes and A. Mahapatro (Wichita State University)

J. M. Bae (Yonsei University), W. J. Lee (Yonsei University, Electronics and Telecommunications Research Institute), J. W. Ma, J. H. Kim, M. H. Cho, S. H. Oh (Yonsei University), and C. Kang (Gwangju Institute Science and Technology)

Y. Zhang, M. Arugula, and A. Simonian (Auburn University)

S. K. Suggu and A. Mahapatro (Wichita State University)

T. Kitamura, S. Park, S. Takai, and T. Yao (Graduate School of Energy Science, Kyoto University)

Y. Zhao (Department of Chemical Engineering, University of Florida), C. Xu, Y. Zou, and K. J. Ziegler (Department of Materials Science and Engineering, University of Florida)

T. Iwai (Graduate School of Energy Science) and T. Yao (Graduate School of Energy Science, Kyoto University)

Y. R. Chung, C. K. Chang, J. H. Liao, and F. B. Wu (National United University)

S. Sepp, J. Nerut, K. Vaarmets, R. Kanarbik, E. Härk, and E. Lust (Institute of Chemistry, University of Tartu)

X. Jiang (School of Materials Science and Engineering, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Tsinghua University, Beijing 100084, China) and H. Zhu (School of Materials Science and Engineering, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Tsinghua University, Beijing 100084, China, Center for Nano and Micro Mechanics, Tsinghua University, Beijing 100084, China)

Z. M. Pavlovic (Max Planck Institute For Chemical Energy Conversion) and C. Ranjan (Max Planck Institute for Chemical Energy Conversion)

C. Xu (Department of Materials Science and Engineering, University of Florida), Y. Zhao (Department of Chemical Engineering, University of Florida), S. Chen, and J. Liu (University of Florida, Department of Chemical Engineering)

J. A. MESA (UNIVERSIDAD DEL VALLE (CALI-COL)), W. H. Lizcano Valbuena, and R. D. J. Camargo Amado (Universidad del Valle)

A. Prakash and K. B. Sundaram (University of Central Florida)

J. W. Oh (Department of Materials Science and Engineering, Korea University, Seoul 136-701, South Korea), H. Na (Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, South Korea), S. Nahm (Department of Materials Science and Engineering, Korea University, Seoul 136-701, South Korea), Y. Kim, and H. Choi (Korea Institute of Industrial Technology, Incheon 406-840, South Korea)

S. Kilgore (Freescale Semiconductor, Inc.)

R. McCormack (Department of Mechanical and Aerospace Engineering, University of Central Florida), N. Shirato (Department of Materials Science & Engineering, University of Tennessee, Knoxville), U. Singh (Department of Material Science and Engineering, University of Central Florida), S. Das (NanoScience Technology Center), A. Kumar (Advanced Materials Processing Analysis Center, University of Central Florida), H. J. Cho (University of Central Florida), R. Kalyanaraman (Department of Materials Science & Engineering, University of Tennessee, Knoxville), and S. Seal (NanoScience Technology Center)

E. N. Moss Jr., R. Nelson, P. L. Moss, and M. H. Weatherspoon (Department of Electrical and Computer Engineering, Florida A&M University - Florida State University College of Engineering, Tallahassee, FL 32310)

M. L. Giraldo (Advanced Materials Processing and Analysis Center, University of Central Florida), C. Shepard (Department of Chemistry - Principia College), T. S. Sakthivel, S. Saraf (University of Central Florida, Advanced Materials Processing and Analysis Center), A. Gupta (Advanced Materials Processing and Analysis Center, University of Central Florida), M. Leuenberger (University of Central Florida), and S. Seal (University of Central Florida, Advanced Materials Processing and Analysis Center)

L. A. Clare and D. K. Smith (San Diego State University)

K. D. Grossman (University of Central Florida, Advanced Materials and Processing Center), D. Reid, S. Saraf, and S. Seal (University of Central Florida)

A. K. Saikumar, G. Skaria (University Of Central Florida), and K. B. Sundaram (University of Central Florida)

S. Seal (Advanced Materials Processing and Analysis Center, NanoScience Technology Center), J. Ortiz (Department of Biology, University of Central Florida), S. Barkam (Advanced Materials Processing and Analysis Center, University of Central Florida), and S. Das (NanoScience Technology Center, University of Central Florida)

V. H. Velez (University of Central Florida), R. G. Mertens (Morehead State University), and K. B. Sundaram (University of Central Florida)

T. R. Garrick, W. Diao, J. Tengco, J. Monnier, and J. W. Weidner (University of South Carolina)

S. Seal (NanoScience Technology Center), S. Saraf (University of Central Florida), J. Thomas (NanoScience Technology Center), Z. Yu, and S. Barkam (University of Central Florida)

B. H. Rainwater (Georgia Institute of Technology), G. H. Waller (School of Materials Science and Engineering, Georgia Institute of Technology), J. P. Lee (Ulsan National Institute of Science and Technology (UNIST)), and M. Liu (School of Materials Science and Engineering, Georgia Institute of Technology)

C. J. Neal (Advanced Materials Processing and Analysis Center), S. Saraf (University of Central Florida), S. Park (Materials Science and Engineering), S. Das (NanoScience Technology Center), H. J. Cho (University of Central Florida), and S. Seal (NanoScience Technology Center)

S. Saraf, T. S. Sakthivel, D. Reid (University of Central Florida), L. Hench (University of central florida), and S. Seal (NanoScience Technology Center)

C. J. Neal (University of Central Florida), S. Das (NanoScience Technology Center), S. Saraf (University of Central Florida), and S. Seal (NanoScience Technology Center)

C. C. Wang (Department of Chemical Engineering, University of Florida), K. J. Ziegler (Department of Materials Science and Engineering, University of Florida), and R. Narayanan (Department of Chemical Engineering, University of Florida)

M. Schrandt (South Dakota School of Mines and Technology), P. Kolla (SDSM&T), and A. Smirnova (South Dakota School of Mines and Technology)

J. F. Stephens (Department of Electrical and Computer Engineering, Florida A&M University - Florida State University College of Engineering, Tallahassee, FL 32310), E. E. Kalu (Florida A&M University - Florida State University College of Engineering), J. Gomez (Department of Chemical & Nuclear Engineering, University of New Mexico), M. H. Weatherspoon (Department of Electrical and Computer Engineering, Florida A&M University - Florida State University College of Engineering, Tallahassee, FL 32310), and J. P. Zheng (Florida State University)

A. T. Pham, L. A. Clare, J. E. Woods, and D. K. Smith (San Diego State University)

J. Chupp, A. Shellikari, and J. Chatterjee (Florida State University)

J. Y. Park and K. Y. Park (Sejong University)

B. Doyle and M. Gong (Georgia Institute of Technology)

S. Sharma, E. Stefanakos, and M. Ram (Clean Energy Research Center, University of South Florida)