E1 Industrial Electrochemistry and Electrochemical Engineering General Session Poster

Tuesday, May 13, 2014: 18:00-20:00
Grand Foyer, Lobby Level (Hilton Orlando Bonnet Creek)
554
Bottom-up through Silicon Via Filling Using Galvanostatic Cu Electrodeposition with Three-Additive Chemistry
H. C. Kim, M. J. Kim, S. Choe (Seoul National University), J. Y. Cho, D. Lee, I. Jung, W. S. Cho (Samsung Fine Chemicals Co., Ltd.), and J. J. Kim (Seoul National University)
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