Study on Oxide Thickness Dependence of Current-Voltage Characteristics for HfOx Based ReRAM Device
Red line in Figure 1 shows I-V characteristics of the Ni/ HfOx/Pt device with oxide thickness of 5.6 nm. Initial state of resistance is HRS. SET process (from HRS to LRS) took place at 2.4 V with a current compliance of 0.1 mA. RESET process (from LRS to HRS) occurred at -1.6 V. The resistance ratio of HRS to LRS is about 107 with 0.1 V readout bias. On the other hand, blue line shows the I-V characteristics of the Ni/ HfO2/Pt device with oxide thickness of 4.0 nm. Initial state of resistance is LRS. Forming process was not observed in this device. SET process took place at 1.0 V. RESET process was observed at -0.6 V. Switching voltage of this device is smaller than the former device with the thicker oxide layer. The resistance ratio of HRS/LRS is about 101 with 0.1 V readout bias. There was a significant difference in switching properties between these devices whose oxide thicknesses differ only 1.6 nm.
It is suggested that leakage current increases when the oxide thickness decreases, thereby the on-state occurred initially for the device with 4.0 nm oxide. It should be noted that I-V characteristic is symmetrical for the device with 4.0 nm oxide, while it is asymmetrical for the device with 5.6 nm oxide. This suggests the mechanism of conductive filament formation and rupture is completely different between these devices. Further discussions and analysis will be presented in the symposium.