Characterization of Bonded Wafers and Devices Part I

Tuesday, 7 October 2014: 07:50-09:20
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Karl D Hobart
Introductory Remarks
(Invited) Water Stress Corrosion in Bonded Structures
F. Fournel, C. Martin-Cocher, D. Radisson, V. Larrey, E. Beche, C. Morales, P. A. Delean (CEA, Leti, Minatec Campus), F. Rieutord (CEA, INAC), and H. Moriceau (CEA, Leti, Minatec Campus)
Surface Characterization for and by Semiconductor Wafer Direct Bonding
R. Knechtel, N. Frohn, and H. Klingner (X-FAB MEMS Foundry GmbH Erfurt)
AlN-AlN Wafer Bonding and Its Thermal Characteristics
S. Bao (Singapore-MIT Alliance for Research and Technology (SMART), Nanyang Technological University), K. H. Lee (Singapore-MIT Alliance for Research and Technology (SMART)), G. Y. Chong (Nanyang Technological University), E. A. Fitzgerald (Singapore-MIT Alliance for Research and Technology (SMART), Massachusetts Institute of Technology), and C. S. Tan (Nanyang Technological University, Nanyang Technological University)