P6 Semiconductor Wafer Bonding 13: Science, Technology, and Applications

Lead Organizer: H. Moriceau (CEA, Leti, Minatec Campus)

Co-organizers: Helmut Baumgart (Applied Research Center at Thomas Jefferson National Accelerator Laboratories) , Karl D Hobart (Naval Research Laboratory) , Roy Knechtel (X-FAB MEMS Foundry GmbH Erfurt) , Tadatomo Suga (The University of Tokyo) , M. S. Goorsky (University of California, Los Angeles) and Chuan Seng Tan (Nanyang Technological University)

Monday, 6 October 2014

Monday | Tuesday | Wednesday | top

10:00-11:50


Fundamentals of Wafer Bonding
Expo Center, 1st Floor, Universal 9
Chair(s): Hubert Moriceau

13:00-15:00


Layer Transfer Techniques
Expo Center, 1st Floor, Universal 9
Chair(s): Frank Fournel and Gerhard Kalkowski

15:20-17:50


III-V Wafer Bonding Applications
Expo Center, 1st Floor, Universal 9
Chair(s): Maik Wiemer and Oussama Moutanabbir

Tuesday, 7 October 2014

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07:50-09:20


Characterization of Bonded Wafers and Devices Part I
Expo Center, 1st Floor, Universal 9
Chair(s): Karl D Hobart

09:40-10:40


Temporary Wafer Bonding
Expo Center, 1st Floor, Universal 9
Chair(s): Laurent Brunet and Ralf Hausner

11:00-12:00


Characterization of Bonded Wafers and Devices Part II
Expo Center, 1st Floor, Universal 9
Chair(s): Lukas Czornomaz

13:00-16:50


Wafer Bonding for MEMS and Packaging
Expo Center, 1st Floor, Universal 9
Chair(s): Chuan Seng Tan and Julie Widiez

Wednesday, 8 October 2014

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07:50-09:20


Other Wafer Bonding Applications
Expo Center, 1st Floor, Universal 9
Chair(s): Helmut Baumgart and Tadatomo Suga

10:00-12:00


Low Temperature Wafer Bonding
Expo Center, 1st Floor, Universal 9
Chair(s): Mark Goorsky and Takehito Shimatsu

14:00-17:00


Metal Bonding and 3D-Integration
Expo Center, 1st Floor, Universal 9
Chair(s): Roy Knechtel and Mark Goorsky