Characterization of Bonded Wafers and Devices Part II

Tuesday, 7 October 2014: 11:00-12:00
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Lukas Czornomaz
Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding
N. Malik (University of Oslo), E. Poppe, K. Schjolberg-Henriksen, M. M. V. Taklo (SINTEF), and T. G. Finstad (University of Oslo)
Large Area Plan-View Transmission Electron Microscopy Sample Preparation for Direct-Bonded Interfaces
B. Beekley, C. R. Roberts, M. S. Salazar (UCLA), and M. S. Goorsky (University of California, Los Angeles)
Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature
N. Malik (University of Oslo), H. Tofteberg, E. Poppe (SINTEF), T. G. Finstad (University of Oslo), and K. Schjolberg-Henriksen (SINTEF)