Characterization of Bonded Wafers and Devices Part II

Tuesday, 7 October 2014: 11:00-12:00
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Chair:
Lukas Czornomaz
11:00
1734
Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding
N. Malik (University of Oslo), E. Poppe, K. Schjolberg-Henriksen, M. M. V. Taklo (SINTEF), and T. G. Finstad (University of Oslo)
11:20
1735
Large Area Plan-View Transmission Electron Microscopy Sample Preparation for Direct-Bonded Interfaces
B. Beekley, C. R. Roberts, M. S. Salazar (UCLA), and M. S. Goorsky (University of California, Los Angeles)
11:40
1736
Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature
N. Malik (University of Oslo), H. Tofteberg, E. Poppe (SINTEF), T. G. Finstad (University of Oslo), and K. Schjolberg-Henriksen (SINTEF)
See more of: P6: Semiconductor Wafer Bonding 13: Science, Technology, and Applications
See more of: Electronic Materials and Processing
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