Layer Transfer Techniques

Monday, 6 October 2014: 13:00-15:00
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Chairs:
Frank Fournel and Gerhard Kalkowski
13:00
1719
Invited: Heterointegration of Semiconductors: Challenges and Opportunities
O. Moutanabbir (Department of Engineering Physics, École Polytechnique de Montréal)
13:40
1720
(Invited) SOI-Type Bonded Structures for Advanced Technology Nodes
J. Widiez, J. M. Hartmann, F. Mazen, S. Sollier (CEA, LETI, MINATEC Campus), C. Veytizou (SOITEC), Y. Bogumilowicz, E. Augendre (CEA, LETI, MINATEC Campus), M. Martin (LTM, CNRS), F. Gonzatti, M. C. Roure, J. Duvernay, V. Loup, C. Euvrard-Colnat, A. Seignard (CEA, LETI, MINATEC Campus), T. Baron, R. Cipro, F. Bassani (LTM, CNRS), A. M. Papon, C. Guedj (CEA, LETI, MINATEC Campus), I. Huyet (SOITEC), M. Rivoire, P. Besson (CEA, LETI, MINATEC Campus), C. Figuet, W. Schwarzenbach, D. Delprat (SOITEC), and T. Signamarcheix (CEA, LETI, MINATEC Campus)
14:20
1721
Epitaxial Growth and Layer Transfer of InP through Electrochemically Etched and Annealed Porous Buried Layers
D. Chen, X. Kou, S. Sareminaeini (UCLA), and M. S. Goorsky (University of California, Los Angeles)
14:40
1722
Direct Bonding Mechanism of ALD-Al2O3 Thin Films
E. Beche, F. Fournel, V. Larrey (CEA, Leti, Minatec Campus), F. Rieutord (CEA, INAC), C. Morales (CEA, Leti, Minatec Campus), A. M. Charvet (CEA, LETI, Minatec Campus), F. Madeira (CEA, LETI), G. Audoit, and J. M. Fabbri (CEA, LETI, Minatec Campus)
See more of: P6: Semiconductor Wafer Bonding 13: Science, Technology, and Applications
See more of: Electronic Materials and Processing
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