Other Wafer Bonding Applications

Wednesday, 8 October 2014: 07:50-09:20
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Helmut Baumgart and Tadatomo Suga
Introductory Remarks
(Invited) Direct Bonding: A Key Enabler for 3D Monolithic Integration
L. Brunet (CEA-LETI MINATEC Campus), P. Batude (CEA, LETI, MINATEC Campus), F. Fournel, L. Benaissa, C. Fenouillet-Beranger (CEA-LETI MINATEC Campus), L. Pasini (STMicroelectronics), F. Deprat, B. Previtali, F. Ponthenier (CEA-LETI MINATEC Campus), A. Seignard (CEA, LETI, MINATEC Campus), C. Euvrard-Colnat (CEA-LETI MINATEC Campus), M. Rivoire, P. Besson, C. Arvet (STMicroelectronics), E. Beche (CEA, Leti, Minatec Campus), O. Rozeau, O. Billoint, O. Turkyilmaz (CEA-LETI MINATEC Campus), F. Clermidy, T. Signamarcheix (CEA, LETI, MINATEC Campus), and M. Vinet (CEA-LETI MINATEC Campus)
Three-Dimensional Integration of Fully Depleted Silicon-on-Insulator Transistor Substrates for CMOS Image Sensors Using Au/SiO2 Hybrid Bonding and XeF2 Etching
K. Hagiwara, M. Goto, Y. Iguchi, H. Ohtake (NHK Science and Technology Research Laboratories), T. Saraya, H. Toshiyoshi, E. Higurashi, and T. Hiramoto (The University of Tokyo)