Other Wafer Bonding Applications

Wednesday, 8 October 2014: 07:50-09:20
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Chairs:
Helmut Baumgart and Tadatomo Suga
07:50
Introductory Remarks
08:00
1745
(Invited) Direct Bonding: A Key Enabler for 3D Monolithic Integration
L. Brunet (CEA-LETI MINATEC Campus), P. Batude (CEA, LETI, MINATEC Campus), F. Fournel, L. Benaissa, C. Fenouillet-Beranger (CEA-LETI MINATEC Campus), L. Pasini (STMicroelectronics), F. Deprat, B. Previtali, F. Ponthenier (CEA-LETI MINATEC Campus), A. Seignard (CEA, LETI, MINATEC Campus), C. Euvrard-Colnat (CEA-LETI MINATEC Campus), M. Rivoire, P. Besson, C. Arvet (STMicroelectronics), E. Beche (CEA, Leti, Minatec Campus), O. Rozeau, O. Billoint, O. Turkyilmaz (CEA-LETI MINATEC Campus), F. Clermidy, T. Signamarcheix (CEA, LETI, MINATEC Campus), and M. Vinet (CEA-LETI MINATEC Campus)
08:40
1746
Three-Dimensional Integration of Fully Depleted Silicon-on-Insulator Transistor Substrates for CMOS Image Sensors Using Au/SiO2 Hybrid Bonding and XeF2 Etching
K. Hagiwara, M. Goto, Y. Iguchi, H. Ohtake (NHK Science and Technology Research Laboratories), T. Saraya, H. Toshiyoshi, E. Higurashi, and T. Hiramoto (The University of Tokyo)
09:00
1747
Development of Materials Integration for Laser Gain Media: Single Crystals and Ceramic (Polycrystalline) Materials and Applications
J. McKay, T. Bai (UCLA), and M. S. Goorsky (University of California, Los Angeles)
See more of: P6: Semiconductor Wafer Bonding 13: Science, Technology, and Applications
See more of: Electronic Materials and Processing
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