Fundamentals in Electrodeposition II

Wednesday, 8 October 2014: 07:40-10:00
Expo Center, 1st Floor, Universal 13 (Moon Palace Resort)
Chairs:
Masanori Hayase and Rohan Akolkar
07:40
1699
Electrodeposited Copper Wire for Transparent Conductive Film
K. Kondo, Y. Ikeda, M. Yokoi, N. Okamoto, and T. Saito (Osaka Prefecture University)
08:00
1700
Applying the Co-Injection Test to Extract Difficult to Measure Process Parameters
L. Boehme and U. Landau (Case Western Reserve University)
08:20
1701
Development of Glyoxylic Acid Based Electroless Copper Deposition on Ruthenium
F. Inoue (Tohoku University/IMEC), H. Philipsen, M. van der Veen, S. Armini, S. Van Huylenbroeck, H. Struyf (IMEC), S. Shingubara (Kansai University), and T. Tanaka (Tohoku University)
08:40
1702
Cu Displacement Plating on Electroless Plated CoWB Layer on SiO2 and Its Adhesion Property
K. Ohta (Kansai University.), F. Inoue (Tohoku University/IMEC), T. Shimizu, and S. Shingubara (Kansai University)
09:00
1703
Glyoxylic Acid as Reducing Agent for Electroless Copper Deposition on Cobalt Liner
F. Inoue (Tohoku University/IMEC), H. Philipsen, M. van der Veen, S. Van Huylenbroeck, S. Armini, H. Struyf (IMEC), S. Shingubara (Kansai University), and T. Tanaka (Tohoku University)
09:20
1704
Stability Evaluation of Non-Agglomerated Pd Nanoparticle Catalysts for Electroless Deposition
N. Nakamura, J. Taniuchi, T. Sone, K. Sasaki (Tanaka Kikinzoku Kogyo K.K.), F. Inoue (Tohoku University), T. Shimizu, and S. Shingubara (Kansai University)
See more of: P5: Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
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