Fundamentals in Electrodeposition II

Wednesday, 8 October 2014: 07:40-10:00
Expo Center, 1st Floor, Universal 13 (Moon Palace Resort)
Chairs:
Masanori Hayase and Rohan Akolkar
07:40
Electrodeposited Copper Wire for Transparent Conductive Film
K. Kondo, Y. Ikeda, M. Yokoi, N. Okamoto, and T. Saito (Osaka Prefecture University)
08:00
Applying the Co-Injection Test to Extract Difficult to Measure Process Parameters
L. Boehme and U. Landau (Case Western Reserve University)
08:20
Development of Glyoxylic Acid Based Electroless Copper Deposition on Ruthenium
F. Inoue (Tohoku University/IMEC), H. Philipsen, M. van der Veen, S. Armini, S. Van Huylenbroeck, H. Struyf (IMEC), S. Shingubara (Kansai University), and T. Tanaka (Tohoku University)
08:40
Cu Displacement Plating on Electroless Plated CoWB Layer on SiO2 and Its Adhesion Property
K. Ohta (Kansai University.), F. Inoue (Tohoku University/IMEC), T. Shimizu, and S. Shingubara (Kansai University)
09:00
Glyoxylic Acid as Reducing Agent for Electroless Copper Deposition on Cobalt Liner
F. Inoue (Tohoku University/IMEC), H. Philipsen, M. van der Veen, S. Van Huylenbroeck, S. Armini, H. Struyf (IMEC), S. Shingubara (Kansai University), and T. Tanaka (Tohoku University)
09:20
Stability Evaluation of Non-Agglomerated Pd Nanoparticle Catalysts for Electroless Deposition
N. Nakamura, J. Taniuchi, T. Sone, K. Sasaki (Tanaka Kikinzoku Kogyo K.K.), F. Inoue (Tohoku University), T. Shimizu, and S. Shingubara (Kansai University)