P5 Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
Lead Organizer: Kazuo Kondo (Osaka Prefecture University)
Co-organizers: Rohan Akolkar (Case Western Reserve University) , D. P. Barkey (University of New Hampshire) , Wei-Ping Dow (National Chung Hsing University) , Masanori Hayase (Tokyo University of Science) , Mitsumasa Koyanagi (Tohoku University) , S. Mathad (S/C Technology Consulting) , Peter Ramm (Fraunhofer Research Institution EMFT Munich) , F. Roozeboom (Eindhoven University of Technology) and Shoso Shingubara (Kansai University)