Fundamentals in Electrodeposition I

Tuesday, 7 October 2014: 15:00-17:00
Expo Center, 1st Floor, Universal 13 (Moon Palace Resort)
Masanori Hayase and Rohan Akolkar
Anodic Oxidation of SPS Resulting in PDS Formation and the Influence of PDS on Electrolytic Copper Via Filling Performance
R. Kimizuka (JCU CORPORATION, Kanto Gakuin University), H. Toda, T. Eda (JCU CORPORATION), and O. Takai (Kanto Gakuin University)
Numerical Analysis of the Correlation between the Cu+ Ion Concentration and the Current Density
T. Hayashi, K. Kondo, M. Yokoi, T. Saito, and N. Okamoto (Osaka Prefecture University)
Bottom-up Copper Deposition in Damascene Features Using Alkali Electrolytes (Cancelled)
Behavior of Cuprous Intermediate by RRDE
K. NIshimura, M. Yokoi, K. Kondo, T. Hayashi, N. Okamoto, and T. Saito (Osaka Prefecture University)
Degradation of Organic Additives and Its Influences on Cu Electrodeposition
S. Choe, M. J. Kim, K. H. Kim, H. C. Kim, A. Lee (Seoul National University), S. K. Kim (School of Integrative Engineering, Chung-Ang University), and J. J. Kim (Seoul National University)