Fundamentals in Electrodeposition I

Tuesday, 7 October 2014: 15:00-17:00
Expo Center, 1st Floor, Universal 13 (Moon Palace Resort)
Chairs:
Masanori Hayase and Rohan Akolkar
15:00
1694
Anodic Oxidation of SPS Resulting in PDS Formation and the Influence of PDS on Electrolytic Copper Via Filling Performance
R. Kimizuka (JCU CORPORATION, Kanto Gakuin University), H. Toda, T. Eda (JCU CORPORATION), and O. Takai (Kanto Gakuin University)
15:40
1695
Numerical Analysis of the Correlation between the Cu+ Ion Concentration and the Current Density
T. Hayashi, K. Kondo, M. Yokoi, T. Saito, and N. Okamoto (Osaka Prefecture University)
 
1696
Bottom-up Copper Deposition in Damascene Features Using Alkali Electrolytes (Cancelled)
16:20
1697
Behavior of Cuprous Intermediate by RRDE
K. NIshimura, M. Yokoi, K. Kondo, T. Hayashi, N. Okamoto, and T. Saito (Osaka Prefecture University)
16:40
1698
Degradation of Organic Additives and Its Influences on Cu Electrodeposition
S. Choe, M. J. Kim, K. H. Kim, H. C. Kim, A. Lee (Seoul National University), S. K. Kim (School of Integrative Engineering, Chung-Ang University), and J. J. Kim (Seoul National University)
See more of: P5: Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
See more of: Electronic Materials and Processing
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