Electronics Packaging

Wednesday, 8 October 2014: 14:00-15:40
Expo Center, 1st Floor, Universal 13 (Moon Palace Resort)
S. Mathad and Shoso Shingubara
Electrodeposition and Characterisation of Novel Ni-NbOx Composite Coatings as a Diffusion Barrier for Liquid Solder Interconnects - Part II: Diffusion Barrier Performance
J. Wang, G. D. Wilcox (Department of Materials, Loughborough University, UK), R. J. Mortimer (Department of Chemistry, Loughborough University, UK), C. Liu (School of Mechanical and Manufacturing Engineering, Loughborough University, UK), and M. A. Ashworth (Department of Materials, Loughborough University, UK)
Comparison of Cu-Sn Compound Formation Between Snag and Pure Sn Solder Bumps by EBSD
U. H. Lee (Samsung Electronics, Thin Film Technology Team), H. J. Lee, S. H. Kim, C. M. Park, H. K. Shin (Department of Materials Science and Engineering Dong-A University), J. Y. Bae (Samsung Electronics, Thin Film Technology Team), and J. Won (Thin film technology team, Memory Division, Samsung electronics)
High Sensitivity, Positive Tone, Low-k Polynorbornene Permanent Dielectric for Electronics Packaging
B. K. Mueller, J. Schwartz, A. Sutlief, and P. A. Kohl (Georgia Institute of Technology)
On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes
C. Cavaco, L. Peng, F. Sebaai, G. Verbinnen, J. Visker, J. Olmen, D. S. Tezcan, and H. Osman (Imec)
Advanced Process Control of Nickel Electrodeposition for Packaging in  Semiconductor Industry
E. Shalyt, J. Wang, V. Parekh, and M. MacEwan (ECI Technology)