Wafer Bonding for MEMS and Packaging

Tuesday, 7 October 2014: 13:00-16:50
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Chairs:
Chuan Seng Tan and Julie Widiez
13:00
1737
(Invited) Wafer-Bonding for MEMS – Status and Trends
R. Hausner (BOSCH GROUP)
13:40
1738
(Invited) Wafer-Level Integration of Embedded Cooling Approaches
S. Paredes, Y. Madhour, G. Schlottig, C. L. Ong, and T. Brunschwiler (IBM Research)
14:20
1739
Low-Temperature Solid-State Bonding Using Hydrogen Radical Treated Solder for Optoelectronic and MEMS Packaging
E. Higurashi, H. Kawai, T. Suga (The University of Tokyo), S. Okada (Senju Metal Industry Co., Ltd.), and T. Hagihara (Shinko Seiki Co., Ltd.)
14:40
Break
15:00
1740
Electrical, Mechanical, and Hermeticity Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints
K. Schjølberg-Henriksen (SINTEF), N. Malik (SINTEF, University of Oslo), E. V. Gundersen, O. R. Christiansen, K. Imenes (Høgskolen i Buskerud og Vestfold), and S. T. Moe (SINTEF)
15:20
1741
Materials Issues in Hermetic Wafer Level Packaging Using Au Thermocompression and Au-Sn Transient Liquid Phase Bonding
D. Chagnon, D. Isik (Department of Engineering Physics, École Polytechnique de Montréal), P. Lévesque (Department of Chemistry, Université de Montréal), F. Lewis, M. Caza, X. T. Le, J. S. Poirier, D. Michel, R. Larger (Teledyne DALSA Semiconducteur), and O. Moutanabbir (Department of Engineering Physics, École Polytechnique de Montréal)
15:40
1742
Detailed Investgations of Inner Cavity Pressure of MEMS Devices Sealed by Wafer Bonding
R. Knechtel, S. Dempwolf, and S. Hering (X-FAB MEMS Foundry GmbH Erfurt)
16:00
1743
Low Activation Temperature Au/Ti Getter Films for Wafer-Level Vacuum Packaging
M. Wu (Univ. Paris Sud), J. Moulin (Université Paris Sud), G. Agnus (Univ. Paris Sud), and A. Bosseboeuf (CNRS, Univ. Paris Sud)
16:20
1744
Leak Rates and Residual Gas Pressure in Cavities Sealed by Metal Thermo-Compression Bonding and Silicon Direct Bonding
K. Schjølberg-Henriksen (SINTEF), N. Malik (University of Oslo, SINTEF), A. Sandvand (Memscap, HBV), G. Kittilsland (SensoNor), and S. T. Moe (SINTEF)
16:40
Concluding Remarks
See more of: P6: Semiconductor Wafer Bonding 13: Science, Technology, and Applications
See more of: Electronic Materials and Processing
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