Fundamentals of Wafer Bonding

Monday, 6 October 2014: 10:00-11:50
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Hubert Moriceau
Welcoming Remarks
(Invited) Glass-Glass Direct Bonding
G. Kalkowski, S. Risse, U. Zeitner, F. Fuchs, R. Eberhardt, and A. Tünnermann (Fraunhofer IOF)
Fracture Dynamics during the Silicon Layer Transfer of the Smart Cut™ Process
D. Massy (CEA, INAC - France), F. Mazen (CEA, LETI, MINATEC Campus), J. Ragani (CEA, INAC), F. Madeira (CEA, LETI), D. Landru (SOITEC, France), and F. Rieutord (CEA, INAC)
Nanomechanical Properties of Standard and Strained SOI Films Fabricated by Wafer Bonding and Layer Splitting
M. A. Mamun (Old Dominion University), K. Zhang, H. Baumgart (Applied Research Center at Thomas Jefferson National Accelerator Laboratories), and A. A. Elmustafa (Old Dominion University)