Temporary Wafer Bonding

Tuesday, 7 October 2014: 09:40-10:40
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Chairs:
Laurent Brunet and Ralf Hausner
09:40
Temporary Wafer Bonding by Polyelectrolyte Interlayers
M. Eichler (Fraunhofer Institute for Surface Engineering and Thin Films IST), H. Dillmann (Technische Universität Braunschweig), L. C. Reim, M. Thomas (Fraunhofer Institute for Surface Engineering and Thin Films IST), and C. P. Klages (Fraunhofer Institute for Surface Engineering and Thin Films IST, Technische Universität Braunschweig)
10:00
Delamination Root Cause in Temporary Bonding
K. Vial (EV Group), F. Fournel (CEA, Leti, Minatec Campus), M. Wimplinger, J. Burggraf, J. Bravin (EV Group), P. Montméat, and M. Pellat (CEA, Leti, Minatec Campus)
10:20
New Temporary Bonding Solution Based on a Vacuum Wafer Carrier
T. Rogers and R. Santilli (Applied Microengineering Ltd)