Temporary Wafer Bonding

Tuesday, 7 October 2014: 09:40-10:40
Expo Center, 1st Floor, Universal 9 (Moon Palace Resort)
Chairs:
Laurent Brunet and Ralf Hausner
09:40
1731
Temporary Wafer Bonding by Polyelectrolyte Interlayers
M. Eichler (Fraunhofer Institute for Surface Engineering and Thin Films IST), H. Dillmann (Technische Universität Braunschweig), L. C. Reim, M. Thomas (Fraunhofer Institute for Surface Engineering and Thin Films IST), and C. P. Klages (Fraunhofer Institute for Surface Engineering and Thin Films IST, Technische Universität Braunschweig)
10:00
1732
Delamination Root Cause in Temporary Bonding
K. Vial (EV Group), F. Fournel (CEA, Leti, Minatec Campus), M. Wimplinger, J. Burggraf, J. Bravin (EV Group), P. Montméat, and M. Pellat (CEA, Leti, Minatec Campus)
10:20
1733
New Temporary Bonding Solution Based on a Vacuum Wafer Carrier
T. Rogers and R. Santilli (Applied Microengineering Ltd)
See more of: P6: Semiconductor Wafer Bonding 13: Science, Technology, and Applications
See more of: Electronic Materials and Processing
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