Advanced Semiconductor Applications I

Tuesday, 7 October 2014: 10:00-12:00
Expo Center, 1st Floor, Universal 16 (Moon Palace Resort)
Laura Nyns , Stefan De Gendt and Robert M Wallace
Challenges with Industrialization of Atomic Layer Deposition of Silicon Nitride
D. Hausmann, J. Henri, J. Sims, K. Kelchner, S. Janjam, and S. Tang (Lam Research Corporation)
In-Situ Studies on 2D Materials
R. M. Wallace (University of Texas at Dallas)
Enabling Sub-10nm Lithography with Atomic Layer Deposition and Block Copolymer Self Assembly
R. Ruiz, Y. A. Chapuis, L. Wan (HGST A Western Digital Company), S. Xiong (University of Chicao), H. Gao, K. Patel, E. Dobisz, A. Bogdanov (HGST A Western Digital Company), P. Nealey (University of Chicago), and T. Albrecht (HGST A Western Digital Company)