Advanced Semiconductor Applications I

Tuesday, 7 October 2014: 10:00-12:00
Expo Center, 1st Floor, Universal 16 (Moon Palace Resort)
Chairs:
Laura Nyns , Stefan De Gendt and Robert M Wallace
10:00
1608
Challenges with Industrialization of Atomic Layer Deposition of Silicon Nitride
D. Hausmann, J. Henri, J. Sims, K. Kelchner, S. Janjam, and S. Tang (Lam Research Corporation)
10:40
1609
In-Situ Studies on 2D Materials
R. M. Wallace (University of Texas at Dallas)
11:20
1610
Enabling Sub-10nm Lithography with Atomic Layer Deposition and Block Copolymer Self Assembly
R. Ruiz, Y. A. Chapuis, L. Wan (HGST A Western Digital Company), S. Xiong (University of Chicao), H. Gao, K. Patel, E. Dobisz, A. Bogdanov (HGST A Western Digital Company), P. Nealey (University of Chicago), and T. Albrecht (HGST A Western Digital Company)
See more of: P1: Atomic Layer Deposition Applications 10
See more of: Electronic Materials and Processing
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