The Path from Invention to Product: Processing for Semiconductor Devices I

Tuesday, 7 October 2014: 14:00-16:20
Expo Center, 1st Floor, Universal 1 (Moon Palace Resort)
Chairs:
Richard Alkire and Alan West
14:00
872
Keynote: Thin Film Magnetic Heads: Break-through of Electroplating into Electronics, Quantum Jump in Magnetic Storage
L. Romankiw (IBM TJ Watson Research Center) and S. Krongelb (Emeritus, IBM T.J. Watson Research Center)
14:40
873
The First Thin Film Electronic Package: From Invention to Manufacturing
S. Krongelb (Emeritus, IBM T.J. Watson Research Center) and L. Romankiw (IBM TJ Watson Research Center)
15:00
874
Electrochemical Flip-Chip Interconnect Technology
H. Deligianni (IBM Thomas J. Watson Research Center), C. L. Arvin (IBM), and L. Romankiw (IBM TJ Watson Research Center)
15:20
875
The Development of a Chemistry and Process for Cu Damascene Plating – from Research to Development to Manufacturing
Q. Huang (IBM, T. J. Watson Research Center), S. Ahmed (IBM Semiconductor Research & Development Center), S. Kitayaporn (IBM T.J. Watson Research Center), A. Avekians (IBM T. J. Watson Research Center), J. Kelly (IBM Albany Nanotechnology Center), A. Sahin (IBM, T. J. Watson Research Center), J. Liu, Y. Sun (IBM T. J. Watson Research Center), T. Cheng (IBM Semiconductor Research & Development Center), and B. Baker-O'Neal (IBM, T. J. Watson Research Center)
15:40
876
Chemical Mechanical Planarization Processes in Cu Interconnects: Invention to Implementation
M. Krishnan (IBM T.J. Watson Research Center)
16:00
877
Electrodeposited Thin Film Solar Cells
H. Deligianni (IBM Thomas J. Watson Research Center), S. Ahmed (University of Limerick), Q. Huang (IBM, T. J. Watson Research Center), and L. Romankiw (IBM TJ Watson Research Center)
See more of: D2: Electrochemical Science and Technology: Challenges and Opportunities in the Path from Invention to Product
See more of: Electrochemical/Electroless Deposition
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