The Path from Invention to Product: Electrodeposition I

Wednesday, 8 October 2014: 10:00-12:00
Expo Center, 1st Floor, Universal 1 (Moon Palace Resort)
Chairs:
Petr Vanýsek and Stanko R. Brankovic
10:00
887
Conditions at the Electrochemical Interface and Their Relation to Electrodeposition of High Moment Soft CoFe Alloys
S. Brankovic (University of Houston)
10:20
888
Solution Equilibria and Electroless Copper Deposition in Alkaline Formaldehyde-Containing Solutions
E. Norkus (Center for Physical Sciences and Technology)
10:40
889
High Speed Electrochemical Deposition Bath for Sn-Ag Alloy and Evaluation of Micro Solder Bump Plated on Ni-Coated Si Wafer
H. S. Kim, S. H. Yi, J. H. Song, S. S. Jeon, B. T. Kim, A. H. Lim (COWON INNOTECH, Inc.), and J. M. Yook (Korea Electronic Technology Institute)
11:00
890
Nanocrystalline Stainless Steel Electrodeposition
M. Hasegawa, S. Yoon, S. Schneider, C. Frantz (EMPA), C. Niederberger (Eleoss GmbH, EMPA), A. Weidenkaff (Institute for Materials Science, University of Stuttgart), J. Michler, and L. Philippe (EMPA)
11:20
891
Electrodeposition of Highly-Textured Nanotwinned Copper
M. Hasegawa, M. Mieszala, Y. Zhang, J. Michler, and L. Philippe (EMPA)
11:40
892
In Situ Stress Measurements Using Cantilever Curvature
G. R. Stafford, M. C. Lafouresse, and U. Bertocci (National Institute of Standards and Technology)
See more of: D2: Electrochemical Science and Technology: Challenges and Opportunities in the Path from Invention to Product
See more of: Electrochemical/Electroless Deposition
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