The Path from Invention to Product: Electrodeposition II

Wednesday, 8 October 2014: 14:00-16:20
Expo Center, 1st Floor, Universal 1 (Moon Palace Resort)
Chairs:
Giovanni Zangari and Gery R. Stafford
14:40
894
Reaction Mechanism of Thiourea as Suppressor in Electroless Cu Deposition Process
M. Kunimoto (Institute for Nanoscience and Nanotechnology, Waseda University), T. Naito (Department of Applied Chemistry, Waseda University), H. Nakai (Department of Chemistry and Biochemistry, Waseda University), and T. Homma (Institute for Nanoscience and Nanotechnology, Waseda University, Department of Applied Chemistry, Waseda University)
15:00
895
Electrochemical Synthesis of High Strength Nanotwin Copper Films
G. Wang, S. Seo, S. Jin, and B. Yoo (Hanyang University)
15:20
896
In Situ Surface Enhanced Raman Spectroscopy Analysis of the Electrochemical Deposition Processes Using Plasmon Antenna Sensors
T. Homma (Department of Applied Chemistry, Waseda University, Institute for Nanoscience and Nanotechnology, Waseda University), T. Yamamoto, M. Nakamura (Department of Applied Chemistry, Waseda University), M. Kunimoto, M. Saito, and M. Yanagisawa (Institute for Nanoscience and Nanotechnology, Waseda University)