Effect of Nano-Silver Ink Composition and Drying Behavior on Its Adhesion on Glass Substrate
The silver colloids first added nano-TiO2 particle by varying solid content and changed pH to 10 to make sure the solution dispersion well. The adhesion of silver colloids to the glass substrate after sintering was then measured according to both ASTM D4541 and ASTM 3359 standards. The results indicated that adhesion increased proportionally with TiO2 solid content; however, this enhancement effect was lessened when the solid content was above 8wt%. Sintering temperature was also beneficial in increasing adhesion to the substrate; however, the electrical resistance of the silver colloids after sintering increased with degree of solid content. This implied that TiO2 solid content simultaneously made adhesion and electrical resistance increased. Consequently, values of TiO2 solid content and sintering temperature were optimal when adhesion and electrical resistivity were balanced. Ultimately, using commercial software Origin to fit the TiO2 solid content and sintering temperature to get the optimum value of adhesion and electrical resistivity.