(Invited) Electrodeposited Micro Thermoelectric Module Design for Hybrid Semiconductor Laser Cooling on a Silicon Photonics Platform
An alternative approach is to integrate thermoelectric temperature control at the device level to simultaneously provide targeted cooling for individual temperature sensitive devices and reduce the footprint of the thermal solution to enable full optoelectronic integration. Here we present the design of a micro thermoelectric cooler (μTEC) integrated around a hybrid laser, i.e., direct band-gap III-V material wafer-bonded to a silicon-on-insulator substrate, where the key fabrication step is the electrodeposition of p-doped (Bi1-xSbx)2Te3 and n-doped Bi2(TexSe1-x)3. We outline the processing requirements needed to ensure backend compatibility with silicon photonics fabrication. Starting with baseline experimental performance data for our hybrid laser technology and thermoelectric properties reported in the literature, we develop a multiphysics numerical model of the hybrid laser with integrated μTEC. We then assess our design in terms of system-level relevant operating temperatures and laser performance requirements. Our results suggest that electrodeposited μTECs can meet the thermal requirements of active photonics devices in silicon photonics under realistic operating conditions. We conclude by highlighting performance enhancements to be gained by improving electrodeposited material processing beyond the state-of-the-art.