Metallization

Thursday, October 15, 2015: 16:20-17:20
103-A (Phoenix Convention Center)
Chair:
Philippe M Vereecken
16:20
947
Electrodeposition of Cu on Nickel Seed Layer/p-Si in Buft Cell
D. Priyadarshani (Indian Institute of Technology Bombay), P. Goradia (Applied Materials), A. Contractor (Indian Institute of Technology), R. Gouk, S. Verhaverbeke (Applied Materials, Inc.), and R. Visser (Applied Materials, Inc.)
 
948
Silane-Free Adhesive Electroless Deposition of a Nickel/Phosphorous Layer on Si Wafer (Cancelled)
 
949
Bottom-up Filling of Damascene Trenches with Cobalt By Electroplating Process (Cancelled)
See more of: E04: Semiconductors, Metal Oxides, and Composites: Metallization and Electrodeposition of Thin Films and Nanostructures 3
See more of: Electrochemical/Electroless Deposition
<< Previous Session | Next Session >>