Wednesday, 1 June 2016
Exhibit Hall H (San Diego Convention Center)
The eutectic Ag-Cu composition is a common brazing alloy. A complex ion bath containing KAg(CN)2, CuCN, KCN and K4P2O7 was used to codeposit Ag and Cu. The effects of KAg(CN)2, KCN and K4P2O7 concentrations on the composition and morphology of electrodeposited Ag-Cu films was investigated in this study. A constant CuCN concentration of 0.1 M was used. The increase in KCN and KAg(CN)2 concentrations caused major increases in Ag contents, but increase in K4P2O7 concentration caused a minor decrease in Ag content of the film. The results are summarized in the figure. The deposits were found to be globular clusters when high KAg(CN)2 concentrations were used. Finer microstructures and higher Ag contents were obseerved in deposits produced in electrolytes containing higher KCN concentrations.
