E02 Poster Session

Wednesday, 1 June 2016: 18:00-20:00
Exhibit Hall H (San Diego Convention Center)
Chair:
Jamin Ryan Pillars
 
1116
Enhanced Catalytic Efficiency and CO Tolerance of Novel Pt Nanostructures Prepared By Pulsed Electrodeposition for Fuel Oxidation Reaction (Cancelled)
 
1117
Electrodeposition of Three-Dimensional Vertically Aligned Nanotubes Array from Interfacial Gaps (Cancelled)
The Influence of Blood Proteins on the Mobility of Self-Propelled Electrodeposited Microtubes
H. Wang, G. Zhao, and M. Pumera (Nanyang Technological University)
Electroless Deposition of Cobalt-Tungsten-Boron Films from Glycine Containing Solutions As Barrier Layer Against Cu Diffusion
E. Norkus, Z. Sukackienė, L. Tamasauskaite-Tamasiunaite, A. Naujokaitis, and V. Jasulaitiene (Center for Physical Sciences and Technology)
Decoration of Fiber Structure Co with Pt or Au Nanoparticles for Catalytic Ppurposes
A. Zabielaite, K. Antanaviciute, A. Balciunaite, L. Tamasauskaite-Tamasiunaite, and E. Norkus (Center for Physical Sciences and Technology)
Temperature Effect on Silver Electrodeposition in a Deep Eutectic Solvent
J. Aldana-González (1Departamento de Ingeniería Metalúrgica, ESIQIE-IPN), L. Botello (3Universidad Simón Bolívar, Departamento de Química), M. G. Montes de Oca-Yemha (Universidad Autónoma Metropolitana-Azcapotzalco), J. Mostany (3Universidad Simón Bolívar, Departamento de Química), M. A. Romero-Romo (Universidad Autónoma Metropolitana Azcapotzalco), E. Arce-Estrada (1Departamento de Ingeniería Metalúrgica, ESIQIE-IPN), and M. Palomar-Pardavé (Universidad Autónoma Metropolitana Azcapotzalco)
The Effect of Pressurized Carbon Dioxide in Cathodic Deposition of Metal Oxide Films
T. F. M. Chang (CREST, JST, Tokyo Institute of Technology, Tokyo Institute of Technology), C. Y. Chen (Tokyo Institute of Technology, CREST, JST, Tokyo Institute of Technology), W. H. Lin, Y. J. Hsu (National Chiao Tung University), and M. Sone (Tokyo Institute of Technology, CREST, JST)
Pulse Electroplating of Au Films with Ultra High Strength
C. Y. Chen (Tokyo Institute of Technology, CREST, JST, Tokyo Institute of Technology), M. Yoshiba, H. Tang (Tokyo Institute of Technology), T. F. M. Chang (CREST, JST, Tokyo Institute of Technology, Tokyo Institute of Technology), D. Yamane (Tokyo Institute of Technology, CREST, JST), K. Machida (NTT Advanced Technology Corporation, Tokyo Institute of Technology), K. Masu (CREST, JST, Tokyo Institute of Technology), and M. Sone (Tokyo Institute of Technology, CREST, JST)
Effects of Organic Additives on Formation of Copper Pillar during Electroplating Process
Y. J. Lee (Korea Institute of Industrial Technology (KITECH), Yonsei University), W. Y. Lee, D. R. Lee, S. H. Jin, and M. H. Lee (Korea Institute of Industrial Technology (KITECH))
The Role of Electrolyte Composition on Codeposited Ag and Cu
F. Ulu (Hasselt University), G. Demirci (Aselsan Inc.), M. Erdogan (Yildirim Beyazit University), and I. Karakaya (Middle East Technical University)