Plasma Processing

Tuesday, 31 May 2016: 08:30-12:10
Aqua 309 (Hilton San Diego Bayfront)
Chairs:
Manfred Engelhardt , Dennis W Hess and O. M Leonte
 
1069
(Invited) Numerical Simulation of a CAP Needle and Its Prospective Therapeutical Applications (Cancelled)
09:10
1070
(Invited) Mechanisms of Plasma Therapy
D. B. Graves (University of California at Berkeley)
09:50
Break
10:10
1071
(Invited) Deep Silicon Etching - Increasingly Relevant >20 Years on!
D. Thomas, M. Muggeridge, J. Hopkins, N. Launay, H. Ashraf, and T. Barrass (SPTS Technologies)
10:50
1072
(Invited) Plasma Process Simulation for Advanced Semiconductor Applications
P. Ventzek (Tokyo Electron America Inc.), A. Ranjan (TEL Technology Center, America LLC), H. Ueda, and K. Ishibashi (Tokyo Electron Ltd.)
11:30
1073
(Invited) Surface Science Aspects of Etching with Atomic Scale Fidelity
T. Lill, K. J. Kanarik (Lam Research), S. S. H. Tan (Lam Research Corporation), M. Shen, Y. Pan (Lam Research), J. Marks (Lam Research Corporation), V. Vahedi, and R. A. Gottscho (Lam Research)
See more of: D04: Plasma and Thermal Processes for Materials Modification, Synthesis and Processing
See more of: Dielectric Science and Materials
<< Previous Session | Next Session >>