Standard off-the-shelf fabrics can be turned into conductive fabrics using electrochemical metallization processes. Entire sheets of metalized fabrics can be easily generated using any one of a number of sensitization-activation-plating processes [1, 2] but selective metallization of fabrics, or generating metallized patterns, is far less common. Here we present photopatterning of metal features on commercially available fabric by combining Nano3D Systems eLOCOS™ electrochemical plating solutions with photopatternable sensitization processes (Fig, 1, 2).

Electroless plating of nickel and copper on fabric using eLOCOS solutions creates metallized fabric with resistances comparable to those of commercially available conductive fabric. Sheets of metalized fabrics are readily available and have applications in electromagnetic shielding and static dissipation. There is interest in being able to pattern metallic paths onto fabric for fabric-printed circuit boards, as well as smart textiles and wearable technology where ease of use and a seamless integration of electronics into fabric is essential for widespread acceptance of new technology. Methods for achieving circuit-like patterns or isolated conductive areas on fabric include ink jet printing, weaving and screen printing conductive polymers. The advantages of using photolithography to generate patterns include cost, scalability, and improved resolution, but using established photolithographic methods on fabric substrates presents new challenges. Overcoming these challenges allows for the application of established selective metallization techniques to be applied to textile-based technologies using methods similar to those used for the manufacture of circuit boards on rigid substrates.

References

1. Lu, Yinxiang. Electroless Copper Plating on 3-Mercaptopropyltriethoxysilane Modified PET Fabric Challenged by Ultrasonic Washing. Applied Surface Science 255 (2009) pp. 8430-8434
2. Simor, Marcel et.al. Atmospheric-Pressure Plasma Treatment of Polyester Nonwoven Fabrics for Electroless Plating. Surface and Coatings Technology 172(1) pp1-6 (2003).