Tuesday, 30 May 2017: 08:40
Norwich (Hilton New Orleans Riverside)
As Si-based electronic devices are approaching their projected scaling limits, layered two-dimensional (2D) materials such as transition metal dichalcogenides (TMDs) are extensively studied as potential new channel materials and fundamental building blocks of emerging sensors and devices.[1-2] In this context, MoS2, WS2 and WSe2 to name a few, are now available for deposition trough different top down approaches. However, their outstanding properties are often degraded during the fabrication processes required for the device integration. For example, the selective growth of 2D TMDs their patterning and the electronics properties fine tuning still remain elusive. Here we report on electrical atomic force microcopy (AFM) and beam analysis techniques which are used to develop a framework of analysis for 2D materials. The latter is applied to understand the local properties of MoS2 comparing pristine material and structures which are selectively grown and patterned.[3] Different growth techniques are investigated. After modelling the tip-sample contact system, we assess the impact of the plasma-induced damages combining the electrical AFMs and Auger emission spectroscopy. We study the local electrical properties of grain boundaries and their transport respectively in pristine and patterned structures for FET devices by conductive atomic force microscopy (C-AFM).
[1] G. Fiori, F. Bonaccorso, G. Iannaccone, T. Palacios, D. Neumaier, A. Seabaugh, S. K. Banerjee, and L. Colombo, “Electronics based on two-dimensional materials,” Nat. Nanotechnol., vol. 9, no. 10, pp. 768–779, 2014.
[2] Desai, S. B., Madhvapathy, S. R., Sachid, A. B., Llinas, J. P., Wang, Q., Ahn, G. H., Javey, A. (2016). MoS 2 transistors with 1-nanometer gate lengths, 354(6308), 2–6.
[3] Chiappe, D., Asselberghs, I., Sutar, S., Iacovo, S., Afanas’Ev, V., Stesmans, A., … Thean, A. (2016). Controlled Sulfurization Process for the Synthesis of Large Area MoS2 Films and MoS2/WS2 Heterostructures. Advanced Materials Interfaces, 3(4), 1–10.